{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Apparatus and method for electrical determination of delamination at one or more interfaces within a semiconductor wafer", "item": "https://www.patentleaderboard.com/patent/6066561"}]}
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Apparatus and method for electrical determination of delamination at one or more interfaces within a semiconductor wafer

US Patent 6066561 · Granted May 23, 2000

Estimated economic value: $21,035,000

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