Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High efficiency semiconductor wafer coating apparatus and method

High efficiency semiconductor wafer coating apparatus and method

US Patent 6017585 · Granted Jan 25, 2000

Estimated economic value: $135,877,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Panel bracelet with replaceable inserted panels2020
Construction element made of a ferromagnetic shape memory material and use there2014
Dielectric gap fill process that effectively reduces capacitance between narrow 2003
Semiconductor device with sidewall spacers having minimized area contacts2003
Method of preparing light-sensitive integrated circuits for packaging2003
Device for influencing the deployment of a gas bag in an airbag module2003
Thermal oxidation method utilizing atomic oxygen to reduce dangling bonds in sil2003
Method of using organic material to enhance STI planarization or other planariza2002
Dielectric gap fill process that effectively reduces capacitance between narrow 2002
Method for decreasing contact resistance of an electrode positioned inside a mis2001
Semiconductor device with self aligned contacts having integrated silicide strin2001
Arrangement for fastening a gas generator2001