Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package having bond fingers with alternate bonding areas

Integrated circuit package having bond fingers with alternate bonding areas

US Patent 6008532 · Granted Dec 28, 1999

Estimated economic value: $21,471,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Interposer for ball grid array (BGA) package1999
Improved laminate package for an integrated circuit and integrated circuit havin1996