Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of bonding a diamond substrate to at least one metal substrate

Method of bonding a diamond substrate to at least one metal substrate

US Patent 6006979 · Granted Dec 28, 1999

Estimated economic value: $3,903,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of improving the properties of adhesion of a non-oxide ceramic substrate 2005
Method of manufacturing an electronic power component, and an electronic power c2003
Method of electrically connecting IGBT transistor chips mounted on an integrated2001
Method of electrically connecting IGBT transistor chips mounted on an integrated2001
Method of fabricating a gate-control electrode for an IGBT transistor2001
Method of fabricating a gate-control electrode for an IGBT transistor2001
Electronic power module, and electronic power system comprising a plurality of s2000
Electronic power module, and electronic power system comprising a plurality of s2000
Power electronic module and power electronic device including such modules2000
Power electronic module and power electronic device including such modules2000
Hermetically sealed thermocompression feedthrough and peripheral seal for high t1996
Method of bonding copper and a substrate for power electronics and made of a non1995