Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of joining a cover material to a substrate utilizing electrically conductive bonding

Method of joining a cover material to a substrate utilizing electrically conductive bonding

US Patent 6004418 · Granted Dec 21, 1999

Estimated economic value: $8,072,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Acoustic insulator with controlled airflow resistance and method of making same2009
Method of manufacturing a composite shoddy2007
Method and apparatus for bonding a cover to a substrate using high frequency mic2007
Pseudo insert molding for trim parts using polyurethane spray process2006
Hybrid vehicle interior component2006
Tire to wheel data transfer system2004
Attachment for seat assembly2002
Apparatus for bonding a cover material to foam1999
Apparatus for bonding a cover material to foam1999
Method for bonding a cover material to a foam cushion1999