Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of drying semiconductor wafers using hot deionized water and infrared drying

Method of drying semiconductor wafers using hot deionized water and infrared drying

US Patent 5983907 · Granted Nov 16, 1999

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Magneto-rheological fluid and clutch using the same2016
Optimizaton of dot placement for thermal drift2012
Magnet cover caulking method of electric motor2010
Method for electric motor terminal welding isolation2009
Surface material for an automobile internal trim panel and automobile internal t2007
Simplified loading device2004
Electromagnetic brake2003
System for reducing wafer contamination using freshly, conditioned alkaline etch2003
Method of purifying alkaline solution and method of etching semiconductor wafers2000
Prevention of edge stain in silicon wafers by ozone dipping1999
Method of polishing semiconductor wafers1999
Prevention of edge stain in silicon wafers by oxygen annealing1999