Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends

Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends

US Patent 5978227 · Granted Nov 2, 1999

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible circuit connector for stacked chip module2006
High density integrated circuit module2005
Stacking system and method2003
Flexible circuit connector for stacked chip module2003
Stacked micro ball grid array packages2001
High density integrated circuit module with complex electrical interconnect rail2001
Method of manufacturing a surface mount package2001
Warp-resistent ultra-thin integrated circuit package fabrication method2001
Method of manufacturing a warp resistant thermally conductive circuit package2001
Ultra high density integrated circuit packages2001
Ultra high density integrated circuit packages2000
Ultra high density integrated circuit packages2000