Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid substrate for cooling an electronic component

Hybrid substrate for cooling an electronic component

US Patent 5958572 · Granted Sep 28, 1999

Estimated economic value: $13,727,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Alert peripheral for notification of events occurring on a programmable user equ2025
Communication device having a heat sink antenna2025
Redundant PLC signals evaluation2025
Alert peripheral for notification of events occurring on a programmable user equ2023
Axle valve module and relay valve module of a compressed-air brake system2022
Electronic devices and corresponding methods for modifying voice coil motor driv2022
Alert peripheral for notification of events occurring on a programmable user equ2022
Managing antenna module heat and RF emissions2022
Heat structure for thermal mitigation2021
Pressure relief device for microphone protection in an electronic device and cor2021
Managing battery current based on temperature2020
Managing noise levels of active cooling devices2020