Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fabrication process for multichip modules using low temperature bake and cure

Fabrication process for multichip modules using low temperature bake and cure

US Patent 5945254 · Granted Aug 31, 1999

Estimated economic value: $106,403,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated 2022
Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated 2020
Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated 2019
Hybrid fabrication method for large area microwave circuits2019
Fabrication of an optical ring resonator device2011
Metamaterial scanning lens antenna systems and methods2007
Plasma descaling of titanium and titanium alloys2000
Plasma descaling of metals2000
Plasma descaling of titanium and titanium alloys1997
Low loss channel waveguide and method for making the same1992
Fabrication of microelectronics using photosensitive polyimides1992
Ultraviolet curing of photosensitive polyimides1992