Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of making a flip-chip bonded GaAs-based opto-electronic device

Method of making a flip-chip bonded GaAs-based opto-electronic device

US Patent 5923951 · Granted Jul 13, 1999

Estimated economic value: $101,644,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Cell and tissue sheet forming package and cell injection equipment2025
Bending mechanism and surgical robotic arm including the same2025
High electron mobility transistor2025
Blood pressure measurement devices and methods2024
Relay assembly with reverse connection protection2024
Generation of three dimensional geological model of geographic site2024
Step voltage identification for multiple inputs2024
Light-emitting device2024
Semiconductor device with strain relaxed layer2024
Semiconductor device with strain relaxed layer2024
Semiconductor device with strain relaxed layer2024
Bifunctional film2024