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Home › Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved

Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved

US Patent 5920120 · Granted Jul 6, 1999

Estimated economic value: $398,744,000 ⓘ

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