Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of customizing integrated circuits by selective secondary deposition of layer interconnect material

Method of customizing integrated circuits by selective secondary deposition of layer interconnect material

US Patent 5885749 · Granted Mar 23, 1999

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Coagulant-enhanced pre-filtration system2010
Methods for reducing the amount of contaminants in water2004
Methods for reducing the amount of contaminants in water2004
Laser fuse and antifuse structures formed over the active circuitry of an integr2003
Vertical fuse structure for integrated circuits containing an exposure window in2002
Vertical fuse structure for integrated circuits containing an exposure window in2002
Vertical fuse structure for integrated circuits and a method of disconnecting th2002
Vertical fuse structure for integrated circuits and a method of disconnecting th2002
Sacrificial bond pads for laser configured integrated circuits2002
Electronic circuit structure with photoresist layer that has non-precision openi2002
Designing integrated circuit gate arrays using programmable logic device bitstre2001
Designing integrated circuit gate arrays using programmable logic device bitstre2001