Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Surface modification of synthetic diamond for producing adherent thick and thin film metallizations for electronic packaging

Surface modification of synthetic diamond for producing adherent thick and thin film metallizations for electronic packaging

US Patent 5853888 · Granted Dec 29, 1998

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Mitigation of whisker growth in tin coatings by alloying with indium2020
System and method for light assisted friction stir processing and welding of met2020
Highly stretchable interconnect devices and systems2017
Electric current induced liquid metal flow and metallic conformal coating of con2010
High temperature niobium alloy2009
Constant-depth scratch test for the quantification of interfacial shear strength1996