Top-via etch technique for forming dielectric membranes

Assignee

• Northrop Grumman

Inventors

• Silaipillayarputhur V. Krishaswamy (1 patents)
• William F. Valek (1 patents)
• Thomas M. Valko (1 patents)
• Curtis E. Milton, Jr. (3 patents)
• Joel Frederick Rosenbaum (1 patents)

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