Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stacked assemblies of semiconductor packages containing programmable interconnect

Stacked assemblies of semiconductor packages containing programmable interconnect

US Patent 5838060 · Granted Nov 17, 1998

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pneumatic muscle analogs for exoskeletal robotic limbs and associated control me2004
Electrically-programmable interconnect architecture for easily-configurable stac2004
Bag closure or clamp made from pliable, resilient hose2004
Integrated two-terminal fuse-antifuse and fuse and integrated two-terminal fuse-1999
Structures for electrostatic discharge protection of electrical and other compon1994