Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Socket assembly for integrated circuit chip carrier package

Socket assembly for integrated circuit chip carrier package

US Patent 5829988 · Granted Nov 3, 1998

Estimated economic value: $16,686,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and apparatus for a thermoplastic homogeneous failure module2020
Method for homogenous thermoplastic seat back assembly2019
Method of manufacturing a tray table2019
Method and apparatus for a homogeneous thermoplastic leg support2018
Thermoplastic injection molded element with integral thermoplastic positioning s2018
Method and system for homogenous thermoplastic seat back assembly2018
Method and apparatus for composite thermoplastic arm rest assembly2017
Tray table and method of manufacture2016
Leadless integrated circuit package having standoff contacts and die attach pad2016
Leadless array plastic package with various IC packaging configurations2014
Leadless integrated circuit package having standoff contacts and die attach pad2014
Pre-bonded substrate for integrated circuit package and method of making the sam2013