Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink

Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink

US Patent 5798171 · Granted Aug 25, 1998

Estimated economic value: $933,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Antimicrobial metallized thin films for refurbishing communal contact surfaces2025
Vehicle emblem incorporating capacitive switch and LED lighting2017
Use of flexible circuits incorporating a heat spreading layer and the rigidizing2015
Multi-turn coil device2013
Method of producing a multi-turn coil from folded flexible circuitry2012
Adherent film with low thermal impedance and high electrical impedance used in a1998