{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for making integrated circuit packaging with reinforced leads", "item": "https://www.patentleaderboard.com/patent/5750422"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for making integrated circuit packaging with reinforced leads

Method for making integrated circuit packaging with reinforced leads

US Patent 5750422 · Granted May 12, 1998

Estimated economic value: $22,021,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Mobile unit for animal ovarian tissue processing2020
Generation of cryptographically strong random numbers using MISRS2008
Method and apparatus that enable a computer user to verify whether they have cor2006
System for and method of assessing chip acceptability and increasing yield2006
Method and apparatus which enable a computer user to verify whether they have co2004
Generation of cryptographically strong random numbers using MISRs2004
Fuel tank with integrated heat shield2002
Heat shield for blow-molded component2001
Roll support1997
Laminated heat shield with prongs and method of manufacturing same1997
Roll support1997
Electronic device packaging assembly1995