Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of packaging a high voltage device array in a multi-chip module

Method of packaging a high voltage device array in a multi-chip module

US Patent 5739582 · Granted Apr 14, 1998

Estimated economic value: $16,408,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated flywheel energy storage system2020
Method and apparatus for simultaneous processing of multiple functions2015
Method and apparatus for supplying and switching power2013
Electrolyte2013
Multiple driver power supply2013
Method and apparatus for supplying and switching power2012
Integrated ultra thin scalable 94 GHz Si power source2012
Multiple driver power supply2011
Four-gate transistor analog multiplier circuit2011
Current controlled driver2011
Method and apparatus for supplying power2010
Electronic drive and acquisition system for mass spectrometry2010