Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High-density wirebond chip interconnect for multi-chip modules

High-density wirebond chip interconnect for multi-chip modules

US Patent 5723906 · Granted Mar 3, 1998

Estimated economic value: $42,417,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Control circuit and method for bus voltage variation in power converters2025
Paralleled DC-DC converters with circulating current suppression circuit2024
Short-circuit protection systems and methods for flying capacitor based buck-boo2024
Control system and method for an energy storage system2021
Maximum power point tracking hybrid control of an energy storage system2021
State of charge maintenance during operation of energy storage systems2021
Manual service disconnect system and method for energy storage2020
System and method for increasing allowable system current in energy storage syst2019
Energy storage device having improved thermal performance2019
Distribution of power commands in an energy storage system2018
Cooling for battery units in energy storage system2018
Systems and methods for controlling performance parameters of an energy storage 2018