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Home › Integrated circuit package with a plurality of vias that are electrically connected to an internal ground plane and thermally connected to an external heat slug

Integrated circuit package with a plurality of vias that are electrically connected to an internal ground plane and thermally connected to an external heat slug

US Patent 5721454 · Granted Feb 24, 1998

Estimated economic value: $81,053,000 ⓘ

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