Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers

Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers

US Patent 5718618 · Granted Feb 17, 1998

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Bi-directional micromechanical latching linear actuator2003
Photodiode arrays having minimized cross-talk between diodes2000
Position control system for use with micromechanical actuators2000
In-situ endpoint detection for membrane formation2000
Radiation mask adapted to be aligned with a photoresist layer and method of maki1999
Alignment method for multi-level deep x-ray lithography utilizing alignment hole1999
Single coil bistable, bidirectional micromechanical actuator1998
Method and apparatus for micromachining using hard X-rays1997
Micromechanical magnetically actuated devices1997
Formation of microstructures using a preformed photoresist sheet1996
Opto-electro-mechanical device or filter, process for making, and sensors made t1996
Formation of microstructures using a preformed photoresist sheet1996