Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of constructing a sealed chip-on-board electronic module

Method of constructing a sealed chip-on-board electronic module

US Patent 5685071 · Granted Nov 11, 1997

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Rotary joint including first and second annular parts defining annular waveguide2016
Heat exchanger2006
Adhesive heater and method for securing an object to a surface1997
Multi-layer film adhesive for electrically isolating and grounding an integrated1997
Orthogonal grid circuit interconnect method1996
Stacked chip assembly and manufacturing method therefor1994
Totally enclosed hermetic electronic module1993
Detection and ranging of material flaws using microwave transmission line reflec1993
Hermetic package for integrated circuit chips1991
Integrated circuit package carrier1990
Diaphragm test probe1990
Stacked wafer electronic package1990