Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High-density programmable logic device in a multi-chip module package with improved interconnect scheme

High-density programmable logic device in a multi-chip module package with improved interconnect scheme

US Patent 5642262 · Granted Jun 24, 1997

Estimated economic value: $29,318,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Self-ready flash null convention logic2015
Method of making a high density programmable logic device in a multichip module 2003
Method of making a high density programmable logic device in a multichip module 2003
Programming circuits and techniques for programmable logic2003
Techniques for programming programmable logic array devices2002
Programmable logic array integrated circuit with general-purpose memory configur2002
Programmable logic array integrated circuit incorporating a first-in first-out m2001
Techniques for programming programmable logic array devices2001
Programmable logic array integrated circuit incorporating a first-in first-out m2000
Programming circuits and techniques for programmable logic2000
Programmable logic array integrated circuit with general-purpose memory configur2000
Access restriction to circuit designs1999