Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Laminated module for stacking integrated circuits

Laminated module for stacking integrated circuits

US Patent 5613033 · Granted Mar 18, 1997

Estimated economic value: $66,095,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Detachable I/O device with built-in RF/IR functionality to facilitate remote aud2000
Detachable I/O device for computer data security1999
Method and apparatus for voltage regulation within an integrated circuit package1998
Compact circuit board switching apparatus and associated methods1997
Mechanical printed circuit board/laminated multi chip module interconnect appara1996
Apparatus and method of making laminate an embedded conductive layer1996
Trace conductor layout configuration for preserving signal integrity in control 1996
Printed circuit board having a land with an inwardly facing surface and method f1996
Laminated multi chip module interconnect apparatus1996
Printed circuit board/chassis grounding apparatus and methods1995