Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package fabrication method and apparatus

Semiconductor device package fabrication method and apparatus

US Patent 5610442 · Granted Mar 11, 1997

Estimated economic value: $31,172,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Interrelated entertainment devices for music and related information2021
Method for planarizing an array of solder balls2000
Method for compensating for bottom warpage of a BGA integrated circuit1999
Method of assembling a heat sink assembly1999
Fluxless solder ball attachment process1999
Stackable heatsink structures for semiconductor devices1999
Technique for mounting a semiconductor die1999
Ball grid array with inexpensive threaded secure locking mechanism to allow remo1999
Powder metal heat sink for integrated circuit devices1999
Powdered metal heat sink with increased surface area1999
Method of manufacturing powdered metal heat sinks having increased surface area1998
Ball grid array package with inexpensive threaded secure locking mechanism to al1998