{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method of forming semiconductor device with a buried junction", "item": "https://www.patentleaderboard.com/patent/5605851"}]}
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Home › Method of forming semiconductor device with a buried junction

Method of forming semiconductor device with a buried junction

US Patent 5605851 · Granted Feb 25, 1997

Estimated economic value: $13,424,000 ⓘ

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