Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device having a via hole with an aspect ratio of not less than four, and interconnections therein

Semiconductor device having a via hole with an aspect ratio of not less than four, and interconnections therein

US Patent 5594278 · Granted Jan 14, 1997

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fuel injector of internal combustion engine and fuel injection method thereof2019
Fuel injection amount control device2018
Fuel injection system2017
Control apparatus for internal combustion engine2007
Control apparatus and method for automatically stopping and starting internal co2005
Control system and method for motor vehicles2005
Semiconductor device and fabrication method thereof2003
Semiconductor device and fabrication method thereof2002
Semiconductor device that prevents peeling of a titanium nitride film1998
Method of forming wiring using sputtered insulating mask1998
Semiconductor device including a pair of transistors having a common channel reg1996