Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for manufacturing wafer

Apparatus and method for manufacturing wafer

US Patent 5582536 · Granted Dec 10, 1996

Estimated economic value: $7,211,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer slice base peeling system1998
Wafer slice base peeling system1998
Wafer slicer base peeling system1998
Grinding apparatus for wafer edge1997
Wafer chamfering machine1997
Wafer diameter/sectional shape measuring machine1996
Method of manufacturing semiconductor wafer and system therefor1995