Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Anisotropic interconnect methodology for cost effective manufacture of high density printed wiring boards

Anisotropic interconnect methodology for cost effective manufacture of high density printed wiring boards

US Patent 5576519 · Granted Nov 19, 1996

Estimated economic value: $42,736,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for real time digitization of hand written input data2021
Computer platform for development and deployment of sensor data based applicatio2019
Computer platform for development and deployment of sensor-driven vehicle teleme2018
Adaptor board interconnection for a processor board and motherboard1999
Circuit board-mounted IC package cooling and method1999
Ceramic integrated circuit package with optional IC removably mounted thereto1998
Circuit board-mounted IC package cooling apparatus1998
Hybrid multichip module and methods of fabricating same1997
Circuit board-mounted IC package cooling apparatus1997
Embedded thermistor for on-board thermal monitoring of electrical components1997
Leadless high density connector1997
Method and apparatus for making staggered blade edge connectors1996