Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Lead-free low melting solder with improved mechanical properties

Lead-free low melting solder with improved mechanical properties

US Patent 5569433 · Granted Oct 29, 1996

Estimated economic value: $11,590,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electrochemical devices comprising compressed gas solvent electrolytes2025
Magnetic refrigeration systems for cryogenic applications2024
Switchable digital scent generation and release, and vapor and liquid delivery m2024
Methods of fabricating nanoscale structures usable in molecular sensors and othe2024
Magnetocaloric alloys useful for magnetic refrigeration applications2023
Solid state sequencing devices comprising two dimensional layer materials2023
Switchable digital scent generation and release, and vapor and liquid delivery m2023
Rotary-type automotive transmission2022
Switchable gas and liquid release and delivery devices, systems, and methods2022
Massively parallel DNA sequencing apparatus2022
Electronic label-free DNA and genome sequencing2022
Magnetocaloric alloys useful for magnetic refrigeration applications2022