Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for wire cutting glass-ceramic wafers

Apparatus and method for wire cutting glass-ceramic wafers

US Patent 5564409 · Granted Oct 15, 1996

Estimated economic value: $25,645,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fiber array and methods for fabricating the fiber array2006
External electrode driven discharge lamp2006
Direct bonding of optical components2004
Lamp envelope with integrated optics2004
External electrode driven discharge lamp2003
Method of centering a fiber core in a multiple-crucible method2003
Temperature-compensated optical grating device2003
Optical fiber with absorbing overclad glass layer2003
Process for drawing optical fiber from a multiple crucible apparatus with a ther2003
Temperature compensated optical device2002
Glass envelope having continuous internal channel with connected sections of dif2002
TIR lens for uniform brightness2002