Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer scribe technique using laser by forming polysilicon

Wafer scribe technique using laser by forming polysilicon

US Patent 5543365 · Granted Aug 6, 1996

Estimated economic value: $16,164,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wing-shaped support members for enhancing semiconductor probes and methods to fo2011
Method and apparatus for non-invasively testing integrated circuits2009
Wavelet analysis of one or more time domain reflectometry (TDR) signals to deter2007
Wavelet analysis of signals to determine characteristics of anomalies in a wire2006
Method and apparatus for non-invasively testing integrated circuits2006
Repackaging semiconductor IC devices for failure analysis2003
Integrated circuit having a sealed edge2002
Integrated circuit having a sealed edge2002
Laser programming of CMOS semiconductor devices using make-link structure2001
Laser programming of CMOS semiconductor devices using make-link structure2001
Laser programming of CMOS semiconductor devices using make-link structure1999
Laser programming of CMOS semiconductor devices using make-link structure1999