Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Lead wire forming apparatus capable of preventing the peeling of the solder from the lead wire

Lead wire forming apparatus capable of preventing the peeling of the solder from the lead wire

US Patent 5535789 · Granted Jul 16, 1996

Estimated economic value: $20,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device2025
Powder conveying device and image forming apparatus incorporating same2024
Deposition method2024
Transfer bias and pressure in an image forming apparatus2023
Cleaning device for cleaning a discharge wire, charger, and image forming appara2022
Film deposition method2022
Developing device with a developer regulator and a stopper2022
Deposition method2021
Method for depositing a silicon nitride film and film deposition apparatus2021
Developer conveyance device and image forming apparatus incorporating same2021
Powder container and image forming apparatus2020
Film deposition method and film deposition apparatus2020