Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of manufacturing a semiconductor device by forming pyramid shaped bumps using a stabilizer

Method of manufacturing a semiconductor device by forming pyramid shaped bumps using a stabilizer

US Patent 5527734 · Granted Jun 18, 1996

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Illumination system with remote phosphor layer and/or scattering layer2016
Halogen dual-beam lamp2008
Method of providing a metal pattern on glass in an electroless process2001
Method of selectively providing a pattern of a material other than glass on a gl1995
Semiconductor contact with discontinuous noble metal1994
Method of providing a copper pattern on a dielectric substrate1993
Method of metallizing contact holes in a semiconductor device1993
Method of selectively providing a metal from the liquid phase on a substrate by 1991
Method of manufacturing a semiconductor device1991