Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaging structure for microwave circuit

Packaging structure for microwave circuit

US Patent 5500556 · Granted Mar 19, 1996

Estimated economic value: $24,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacturing a composite microwave circuit module1999
High-frequency device package1999
Composite microwave circuit module having a pseudo-waveguide structure1998
Protecting device for protecting an electronic equipment in order to use the ele1996
Radio transceiver in which the length is dimensioned based on power output requi1996
Composite microwave circuit module assembly and its connection structure1995
Apparatus and method for assembling and checking microwave monolithic integrated1995
Combined transmitter and receiver for satellite communication systems1994
Microwave connector assembly connected easily to microwave circuit components1993
Separate type branching filter1993
Transmission and reception unit for a mini-earth station1990
Microwave transmitter/receiver apparatus1990