Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Tape with solder forms and methods for transferring solder to chip assemblies

Tape with solder forms and methods for transferring solder to chip assemblies

US Patent 5497938 · Granted Mar 12, 1996

Estimated economic value: $98,570,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stacked chip packaging2005
Retention mechanism assembly for processor cartridges with captured screw fasten2001
"Organic substrate (PCB) slip plane ""stress deflector"" for flip chip devices"2001
Flip-chip having electrical contact pads on the backside of the chip2000
Hot shear apparatus and method for removing a semiconductor chip from an existin2000
Computer package with a polygonal shaped motherboard1999
High performance power and ground edge connect IC package1999
Design for mounting discrete components inside an integrated circuit package for1998
Integrated circuit solder-rack interconnect module1998
"Organic substrate (PCB) slip plane ""stress deflector"" for flip chip deivces"1998
Multi-chip integrated circuit package1998
Tape with solder forms for semiconductor devices1998