Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for thinning a semiconductor wafer

Method for thinning a semiconductor wafer

US Patent 5476566 · Granted Dec 19, 1995

Estimated economic value: $14,309,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Back side metallization2022
Back side metallization2021
Back side metallization2019
Back side metallization2019
Semiconductor chip metal alloy thermal interface material2017
Method for molding using an ion implanted mold1998
Plastic and grid array semiconductor device and method for making the same1994