Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of fabricating metallized substrates using an organic etch block layer

Method of fabricating metallized substrates using an organic etch block layer

US Patent 5474956 · Granted Dec 12, 1995

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Phase mask laser fabrication of fine pattern electronic interconnect structures1998
Phase mask laser fabrication of fine pattern electronic interconnect structures1998
Phase mask laser fabrication of fine pattern electronic interconnect structures1998
Phase mask laser fabrication of fine pattern electronic interconnect structures1998
Methods of fabricating an HDMI decal chip scale package1998
Methods of forming two-sided HDMI interconnect structures1997
Methods of forming two-sided HDMI interconnect structures1997
Electrical interconnection substrate with both wire bond and solder contacts, an1995
Electrical interconnection substrate with both wire bond and solder contacts, an1995
Electrical interconnection substrate with both wire bond and solder contacts1994
Electrical interconnection substrate with both wire bond and solder contacts1994
Method of forming an electrical via structure1991