Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of high yield manufacture of VLSI type integrated circuit devices by determining critical surface characteristics of mounting films

Method of high yield manufacture of VLSI type integrated circuit devices by determining critical surface characteristics of mounting films

US Patent 5473433 · Granted Dec 5, 1995

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process of manufacturing an intergrated circuit having an interferometrically pr1999
Method of preparing silicon wafers1996
Integrated circuits from wafers having improved flatness1989
Method of contouring crystal plates1985
Method of contouring crystal plates1983
Method and apparatus for testing the orientation of crystal plates1982
Adjusting the frequency of piezoelectric crystal devices via fracturing the crys1980