Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming conductive interconnect structure

Method of forming conductive interconnect structure

US Patent 5441914 · Granted Aug 15, 1995

Estimated economic value: $9,023,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for etching of metal2025
Blood oxygenation treatment methods and devices2025
Bonded structure including an obstructive element directly bonded to a semicondu2025
Methods and technology for creating connections and shunts between vessels and c2025
Sealed bonded structures and methods for forming the same2025
Prosthetic heart valve with atrial sealing member2025
Methods and apparatus to prevent lock-up of high-speed pseudo-differential frequ2025
Prosthetic heart valve, systems, and methods2025
Method of implanting a spacer body in a mitral valve2025
Spring and coil devices for papillary muscle approximation and ventricle remodel2025
Capacitive coupling in a direct-bonded interface for microelectronic devices2025
Stacked dies and methods for forming bonded structures2025