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Home › Optimal PCB routing methodology for high I/O density interconnect devices

Optimal PCB routing methodology for high I/O density interconnect devices

US Patent 5424492 · Granted Jun 13, 1995

Estimated economic value: $10,731,000 ⓘ

Assignee

Dell Usa

Inventors

Robert Petty (2 patents)
Michael D. Ohlinger (2 patents)
Deepak Swamy (21 patents)
Joseph Daniel Mallory (19 patents)

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