Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of manufacturing a circuit carrying substrate having coaxial via holes

Method of manufacturing a circuit carrying substrate having coaxial via holes

US Patent 5421083 · Granted Jun 6, 1995

Estimated economic value: $7,064,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Solder pads with concave edges for ball grid arrays2025
Inductive landing apparatus for an unmanned aerial vehicle2020
Mobile law enforcement communication system and method2018
Connector device2016
Control interface for a communication device2016
Electrical contact pin having a ledge and/or a groove coupled to a printed circu2016
Substrate having trim window in a C5 array2001
Evaporative cooling vessel for controlling the temperature of a portion of an el1999
Method for automatic conveyor width adjustment1998
Transparent or reflective liquid crystal display assembly with electrochromic an1998
Method of forming high resolution circuitry by depositing a polyvinyl alcohol la1998
Gas detection system for a portable communication1998