Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby

Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby

US Patent 5403785 · Granted Apr 4, 1995

Estimated economic value: $58,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Heating device, substrate processing system, and heating method2025
Teaching method for transfer device, and transfer system2025
Composition for sterilization and cleaning, method for producing same, and steri2025
Heating device and heating method2025
Positive electrode active material and method of producing positive electrode ac2025
Composite printed wiring board and method of manufacturing composite printed wir2025
Image identifying apparatus, video reproducing apparatus, image identifying meth2025
Vehicle system2024
Nozzle, solid matter unloading device, solid matter unloading system, and solid 2024
Shock absorbing laminate and display device2024
Antenna2024
Positive electrode active material and method of producing positive electrode ac2024