Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic package comprising metal housing grounded to board edge

Microelectronic package comprising metal housing grounded to board edge

US Patent 5398169 · Granted Mar 14, 1995

Estimated economic value: $15,284,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Housing assembly for an appliance2025
Body-mounted hinge assembly component2024
Convection heating element2023
Body-mounted hinge assembly component2022
Support frame for an appliance2022
Device with modal lighting control and method thereof2009
Electronic chassis and housing having an integrated forced air cooling system2005
Combination internal modem and PC card radio operable in multiple modes2003
Method and apparatus for increasing heat transfer that is restricted in thermall2001
Method and apparatus for reducing power in radio transmitters2001
Wireless packet data communications modem and method of use therein2000
Current booster for PC card1998