Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Molded semiconductor device using intermediate lead pattern on film carrier formed from lattice pattern commonly available for devices and process of fabrication thereof

Molded semiconductor device using intermediate lead pattern on film carrier formed from lattice pattern commonly available for devices and process of fabrication thereof

US Patent 5393705 · Granted Feb 28, 1995

Estimated economic value: $16,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device capable of suppressing generation of cracks in semiconducto2013
Semiconductor device with hollow and throughhole and method of manufacturing sam2012
Plastic packaged semiconductor device1993