Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Composition to be used in the resin injection molding technique, containing low molecular weight compounds jointly forming a hybrid network

Composition to be used in the resin injection molding technique, containing low molecular weight compounds jointly forming a hybrid network

US Patent 5369176 · Granted Nov 29, 1994

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Resin composition containing low-molecular weight compounds which form a polyest1995
Process and resin composition for the manufacture of cast, injection moulded or 1994
Bismaleimide-styrene compound-acid compound-containing thermosetting composition1991
Thermosetting composition1990
Method for preparing compositions containing maleimide-amide compounds1988
Bismaleimide compositions1988
Compositions containing maleimide-amide compounds as well as the preparation and1987
Compositions containing maleimide-amide compounds as well as the preparation and1986