Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of and arrangement for bond wire connecting together certain integrated circuit components

Method of and arrangement for bond wire connecting together certain integrated circuit components

US Patent 5328079 · Granted Jul 12, 1994

Estimated economic value: $4,524,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Bump bond structure for enhanced electromigration performance2022
Fan-out electronic device2022
Integrated circuit backside metallization2022
3D-printed protective shell structures with support columns for stress sensitive2021
Packaged semiconductor device with multilayer stress buffer2021
Copper passivation2021
Integrated circuit backside metallization2020
Bump bond structure for enhanced electromigration performance2020
Additive deposition low temperature curable magnetic interconnecting layer for p2020
Printed repassivation for wafer chip scale packaging2020
3D-printed protective shell structures for stress sensitive circuits2019
Integrated circuit package with sensor and method of making2018