Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Molding materials based on unsaturated copolyamides

Molding materials based on unsaturated copolyamides

US Patent 5326850 · Granted Jul 5, 1994

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polymer film containing an amorphous and a partially crystalline polyamide2023
Polymer film comprising a copolyamide of a diamine, a dimer acid and a lactam2021
Preparing ether carboxylates2015
Process for preparing hydrocyanic acid by catalytic dehydration of gaseous forma2015
Preparing ether carboxylates2012
Aqueous solutions containing metal cyanide for cyanide leaching for the winning 2011
Method for producing prussic acid2010
Nonodorous ethylene homopolymers and copolymers having good mechanical propertie2010
Method for the production of hydrocyanic acid2009
Ethylene terpolymer waxes, their preparation and their use2009
Polymerization catalyst used for producing polyolefins that have excellent combi2008
Thixotropic agents comprising ethylene terpolymer waxes2006