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Home › Electromechanical module with small footprint and post-solder attachable/removable heat sink frame

Electromechanical module with small footprint and post-solder attachable/removable heat sink frame

US Patent 5307239 · Granted Apr 26, 1994

Estimated economic value: $14,854,000 ⓘ

Assignee

Unisys

Inventors

Paul McCarty (4 patents)
Jerry Ihor Tustaniwskyj (52 patents)
Jon Zimmerman (4 patents)

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